The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 20, 2018

Filed:

Apr. 07, 2014
Applicant:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, Ibaraki, JP;

Inventors:

Takuro Kanazawa, Tokyo, JP;

Kinya Nakatsu, Tokyo, JP;

Haruaki Motoda, Hitachinaka, JP;

Assignee:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); B62D 5/04 (2006.01); H02K 7/116 (2006.01); H02K 9/00 (2006.01); H02M 7/537 (2006.01); H02K 11/33 (2016.01); H02M 7/00 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20418 (2013.01); B62D 5/04 (2013.01); B62D 5/0406 (2013.01); H02K 7/116 (2013.01); H02K 7/1166 (2013.01); H02K 9/00 (2013.01); H02K 11/33 (2016.01); H02M 7/537 (2013.01); H05K 7/209 (2013.01); H02M 7/003 (2013.01);
Abstract

An inverter () is disposed toward an opening in a motor side metal housing (). A power module () is disposed on a metal cover () that is in contact with the metal housing (). The power module () includes a semiconductor element, a metal terminal connected to the semiconductor element, and resin that seals the semiconductor element and the metal terminal. A metal plate () is disposed on a surface of the power module () that is positioned opposite the metal cover (). Heat generated by the power module () is dissipated from the metal cover () and from the metal plate (). This improves the heat dissipation performance. Thus, the size of the power module can be reduced.


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