The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 20, 2018

Filed:

Sep. 09, 2015
Applicant:

Yazaki Corporation, Minato-ku, Tokyo, JP;

Inventor:

Yukihiro Kawamura, Shizuoka, JP;

Assignee:

YAZAKI CORPORATION, Minato-ku, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/14 (2006.01); B60R 16/023 (2006.01); H01R 13/436 (2006.01); H05K 5/02 (2006.01); H01H 50/04 (2006.01); H01R 13/514 (2006.01);
U.S. Cl.
CPC ...
H05K 7/14 (2013.01); B60R 16/0238 (2013.01); H01R 13/4362 (2013.01); H05K 5/0217 (2013.01); H05K 5/0247 (2013.01); B60R 16/0239 (2013.01); H01H 50/04 (2013.01); H01R 13/514 (2013.01);
Abstract

An electronic component having plural lead terminals protruding from side surfaces of a component main body is inserted and accommodated in a housing member, and the lead terminals are brought into contact with plural terminal fittings held in the housing member to assemble the electronic component into the housing member. Each of the lead terminals includes a base end protruding from at least one side surface of the component main body and a contact portion connected to the base end to droop along the side surface. The component main body is provided with an insulating member which is located to contact or face the base ends from a side of an end surface of the component main body which is most distant from a bottom wall of the housing member in assembling the electronic component into the housing member. Accordingly, it is possible to suppress deformation of the lead terminals.


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