The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2018
Filed:
Jul. 03, 2017
Applicant:
Quartzdyne, Inc., Salt Lake City, UT (US);
Inventor:
Mark Hahn, South Jordan, UT (US);
Assignee:
Quartzdyne, Inc., Salt Lake City, UT (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H05K 3/10 (2006.01); H05K 3/32 (2006.01); B23K 26/21 (2014.01); B23K 9/09 (2006.01); B23K 9/167 (2006.01); B23K 26/0622 (2014.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 3/103 (2013.01); B23K 9/091 (2013.01); B23K 9/167 (2013.01); B23K 26/0622 (2015.10); B23K 26/21 (2015.10); H05K 1/18 (2013.01); H01L 24/02 (2013.01); H01L 24/07 (2013.01); H01L 24/08 (2013.01); H01L 24/09 (2013.01); H01L 24/42 (2013.01); H01L 24/44 (2013.01); H01L 24/45 (2013.01); H01L 24/46 (2013.01); H01L 24/85 (2013.01); H01L 2224/02163 (2013.01); H01L 2224/02185 (2013.01); H01L 2224/80007 (2013.01); H01L 2224/80009 (2013.01); H01L 2224/8019 (2013.01); H01L 2224/8034 (2013.01); H05K 3/328 (2013.01); H05K 2201/10242 (2013.01); H05K 2201/10265 (2013.01); H05K 2201/10287 (2013.01);
Abstract
A method of forming a microelectronic device structure comprises coiling a portion of a wire up and around at least one sidewall of a structure protruding from a substrate. At least one interface between an upper region of the structure and an upper region of the coiled portion of the wire is welded to form a fused region between the structure and the wire.