The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 20, 2018

Filed:

Nov. 06, 2015
Applicant:

Samsung Sdi Co., Ltd., Yongin-si, Gyeonggi-do, KR;

Inventors:

Woo-Jin Lee, Yongin-si, KR;

Seong-Joon Lee, Yongin-si, KR;

Assignee:

Samsung SDI Co., Ltd., Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H05K 1/118 (2013.01); H05K 3/363 (2013.01); H05K 2201/0397 (2013.01); H05K 2201/09172 (2013.01); H05K 2201/10977 (2013.01);
Abstract

A flexible printed circuit board is disclosed. In one aspect, the flexible printed circuit board includes a plurality of signal-transmitting lines formed in a signal-transmitting area and a plurality of first pads formed in a pad area adjacent to the signal-transmitting area and electrically connected to the signal-transmitting lines. The flexible printed circuit board also includes an adhesive-penetrating groove formed between two adjacent ones of the first pads. The adhesive-penetrating groove is formed in a length direction extending from the pad area to at least a portion of the signal-transmitting area.


Find Patent Forward Citations

Lee, Woo-Jin. (2018). Flexible printed circuit board (U.S. Patent No. 10136515). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10136515

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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