The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 20, 2018

Filed:

Feb. 15, 2013
Applicant:

Massachusetts Institute of Technology, Cambridge, MA (US);

Inventors:

Benjamin Roy Moss, Brookline, MA (US);

Jason Scott Orcutt, Somerville, MA (US);

Vladimir Marko Stojanovic, Lexington, MA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 10/516 (2013.01); G02F 1/025 (2006.01); G02F 1/01 (2006.01); H01L 21/8234 (2006.01); H01L 31/105 (2006.01); H01L 31/18 (2006.01);
U.S. Cl.
CPC ...
H04B 10/516 (2013.01); G02F 1/0121 (2013.01); G02F 1/0123 (2013.01); G02F 1/025 (2013.01); H01L 21/823437 (2013.01); H01L 31/105 (2013.01); H01L 31/18 (2013.01); G02F 2203/15 (2013.01);
Abstract

Devices and techniques for integrated optical data communication. A method of encoding symbols in an optical signal may include encoding a first symbol by injecting charge carriers, at a first rate, into a semiconductor device, such as a PIN diode. The method may also include encoding a second symbol by injecting charge carriers, at a second rate, into the semiconductor device. The first rate may exceed the second rate. A modulator driver circuit may include a resistive circuit coupled between supply terminal and drive terminals. The modulator driver circuit may also include a control circuit coupled between a data terminal and the resistive circuit. The control circuit may modulate a resistance of the resistive circuit by selectively coupling one or more of a plurality of portions of the resistive circuit to the drive terminal based on data to be optically encoded. In some embodiments, a modulator driver circuit and an optical modulator may be integrated on the same die or stacked (3D integrated) die and connected with through-oxide or through-silicon vias.


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