The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 20, 2018

Filed:

May. 24, 2017
Applicant:

Oclaro Japan, Inc., Kanagawa, JP;

Inventors:

Daisuke Noguchi, Kanagawa, JP;

Kazuhiro Komatsu, Tokyo, JP;

Assignee:

Oclaro Japan, Inc., Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/022 (2006.01); H01S 5/062 (2006.01); H01S 5/024 (2006.01);
U.S. Cl.
CPC ...
H01S 5/02212 (2013.01); H01S 5/02276 (2013.01); H01S 5/06226 (2013.01); H05K 999/99 (2013.01); H01S 5/02288 (2013.01); H01S 5/02469 (2013.01);
Abstract

An optical module includes: a wiring substrate that has a wiring pattern including a connecting portion and is arranged on an optical subassembly so as to be electrically connected thereto; and a flexible insulating layer formed between the optical subassembly and the wiring substrate. The optical subassembly includes: a conductive stem that has a surface opposed to the wiring substrate, the conductive stem being shaped so that the surface has a through hole opened therein and being connected to a reference potential; and a signal lead for transmitting a signal, the signal lead passing through the through hole while being electrically insulated from the conductive stem. The signal lead passes through the flexible insulating layer to be joined to the connecting portion. The flexible insulating layer is in contact with the connecting portion, the signal lead, and the surface of the conductive stem.


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