The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 20, 2018

Filed:

Jan. 30, 2017
Applicant:

Leviton Manufacturing Co., Inc., Melville, NY (US);

Inventors:

Wenbo Cui, Bothell, WA (US);

Jon Clark Riley, Redmond, WA (US);

Bret Taylor, Seattle, WA (US);

Kenn Peterson, Bothell, WA (US);

Stephen M. Morton, Bothell, WA (US);

Phil R. Mansur, Bothell, WA (US);

Ryan C. Moore, Mill Creek, WA (US);

Assignee:

LEVITON MANUFACTURING CO., INC., Melville, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01R 24/00 (2011.01); H01R 24/62 (2011.01); H01G 4/38 (2006.01); H01R 13/6466 (2011.01); H01R 13/66 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H01G 4/40 (2006.01); H01R 13/6461 (2011.01); H01R 12/58 (2011.01); H01R 24/64 (2011.01); H01R 107/00 (2006.01);
U.S. Cl.
CPC ...
H01R 24/62 (2013.01); H01G 4/38 (2013.01); H01G 4/40 (2013.01); H01R 13/6466 (2013.01); H01R 13/665 (2013.01); H05K 1/0245 (2013.01); H05K 1/116 (2013.01); H05K 1/181 (2013.01); H01R 12/585 (2013.01); H01R 13/6461 (2013.01); H01R 23/005 (2013.01); H01R 24/64 (2013.01); H01R 2107/00 (2013.01); H05K 2201/10015 (2013.01);
Abstract

A communication plug configured to be mated with a communication outlet. The plug has first contacts configured to physically contact and form electrical connections with second contacts of the outlet. The plug also includes a substrate with wire contacts and first, second, third, and fourth layers. The first layer includes first conductors connecting a first portion of the first contacts with a first portion of the wire contacts. The fourth layer includes second conductors connecting a second portion of the first contacts with a second portion of the wire contacts. The second layer includes a first plurality of capacitor plates electrically connected to first selected ones of the first contacts. The third layer includes a second plurality of capacitor plates electrically connected to second selected ones of the first contacts. Each of the first plurality of capacitor plates forms a capacitor with at least one of the second plurality of capacitor plates.


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