The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 20, 2018

Filed:

Jun. 01, 2017
Applicant:

Hitachi Metals, Ltd., Minato-ku, Tokyo, JP;

Inventor:

Hideki Nonen, Mito, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 4/02 (2006.01); H01R 24/60 (2011.01); H01R 13/6593 (2011.01); H01R 13/58 (2006.01); H01R 107/00 (2006.01);
U.S. Cl.
CPC ...
H01R 24/60 (2013.01); H01R 4/023 (2013.01); H01R 13/58 (2013.01); H01R 13/6593 (2013.01); H01R 2107/00 (2013.01);
Abstract

In a communication cable having a multi-core cable with a plurality of core cables in which a pair of signal lines are covered with an insulator, in which the insulator is covered with a shield tape, and in which the shield tape is covered with a wrapping tape, and having a connector formed on an end portion of the multi-core cable, the communication cable further has a substrate to which each core cable is connected; a first joint portion at which the signal line and the substrate are solder-joined to each other; a second joint portion at which the shield tape and the substrate are solder-joined to each other; and a resin portion which molds a connection portion between the core cable and the substrate, and the connection portion excluding the first joint portion and the second joint portion is molded by the resin portion.


Find Patent Forward Citations

Loading…