The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 20, 2018

Filed:

Feb. 09, 2018
Applicant:

Lotes Co., Ltd, Keelung, TW;

Inventors:

Chin Chi Lin, Keelung, TW;

Cheng Wei Lo, Keelung, TW;

Assignee:

LOTES CO., LTD, Keelung, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/6591 (2011.01); H01R 12/71 (2011.01); H01R 13/405 (2006.01); H01R 13/6581 (2011.01); H05K 7/20 (2006.01); H01L 23/367 (2006.01); H01R 12/72 (2011.01); H01R 12/73 (2011.01); H01R 13/52 (2006.01); H01R 12/53 (2011.01); H01R 12/57 (2011.01); H01R 13/506 (2006.01); H01R 13/516 (2006.01); H01R 13/66 (2006.01); H05K 1/02 (2006.01); H01R 13/6594 (2011.01);
U.S. Cl.
CPC ...
H01R 13/6591 (2013.01); H01L 23/3675 (2013.01); H01R 12/53 (2013.01); H01R 12/57 (2013.01); H01R 12/716 (2013.01); H01R 12/725 (2013.01); H01R 12/732 (2013.01); H01R 13/405 (2013.01); H01R 13/506 (2013.01); H01R 13/516 (2013.01); H01R 13/5213 (2013.01); H01R 13/5216 (2013.01); H01R 13/6581 (2013.01); H01R 13/665 (2013.01); H05K 1/0203 (2013.01); H05K 7/2039 (2013.01); H05K 7/20154 (2013.01); H01R 13/6594 (2013.01);
Abstract

An electrical connector assembly includes: a circuit board; a connector, located in front of the circuit board and electrically connected to the circuit board; a chip, provided on the circuit board, and electrically connected to the circuit board; a metal shell, covering the connector and the circuit board; and an inner film, made of a high heat conductive material, and wrapping the chip and the circuit board. At least a part of the inner film is located between the metal shell and the circuit board. When the chip generates a great amount of heat, the inner film, serving as a medium, can absorb the heat rapidly and conduct the heat to the metal shell so as to dissipate the heat outside.


Find Patent Forward Citations

Loading…