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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10134966 B1

PDFFull Text
Date of Patent:
Nov. 20, 2018

Filed:

Feb. 26, 2016

Light emitting device

Applicant:

Nichia Corporation, Anan-shi, Tokushima, JP;

Inventors:

Yasuo Fujikawa, Yokohama, JP;

Takuya Wasa, Kaifu-gun, JP;

Yosuke Nakayama, Komatsushima, JP;

Assignee:

Nichia Corporation, Anan-shi, JP;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Shouxiang Hu

Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/62 (2010.01); H05K 1/14 (2006.01); H01L 27/15 (2006.01); F21K 9/00 (2016.01); H01L 25/075 (2006.01); H05K 3/36 (2006.01); F21Y 101/00 (2016.01); F21Y 107/70 (2016.01); F21Y 105/16 (2016.01); F21Y 103/10 (2016.01); F21Y 115/10 (2016.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); F21K 9/00 (2013.01); H01L 25/0753 (2013.01); H01L 27/156 (2013.01); H05K 1/141 (2013.01); H05K 3/363 (2013.01); F21Y 2101/00 (2013.01); F21Y 2103/10 (2016.08); F21Y 2105/16 (2016.08); F21Y 2107/70 (2016.08); F21Y 2115/10 (2016.08); H05K 1/118 (2013.01); H05K 2201/09172 (2013.01); H05K 2201/09781 (2013.01); H05K 2201/10106 (2013.01);
Abstract

A light emitting device includes a first substrate including a flexible first base member and a first wiring pattern provided on the first base member; a second substrate including a second base member and a second wiring pattern provided on the second base member; and a plurality of light emitting elements mounted on the first wiring pattern. The first substrate includes: a joining end portion that is located at a first, joining end of the first substrate, and that overlaps a portion of the second substrate, and a second end, other than the joining end, that does not overlap the second substrate. The first wiring pattern and the second wiring pattern do not face each other. An electrically conductive joining member is disposed across the first wiring pattern and the second wiring pattern, while partially covering the joining end portion of the first substrate.

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