The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 20, 2018

Filed:

Jun. 19, 2017
Applicant:

Epistar Corporation, Hsinchu, TW;

Inventors:

Po-Shun Chiu, Hsinchu, TW;

De-Shan Kuo, Hsinchu, TW;

Jhih-Jheng Yang, Hsinchu, TW;

Jiun-Ru Huang, Hsinchu, TW;

Jian-Huei Li, Hsinchu, TW;

Ying-Chieh Chen, Hsinchu, TW;

Zi-Jin Lin, Hsinchu, TW;

Assignee:

EPISTAR CORPORATION, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/22 (2010.01); H01L 33/10 (2010.01);
U.S. Cl.
CPC ...
H01L 33/0095 (2013.01); H01L 33/22 (2013.01); H01L 33/10 (2013.01);
Abstract

A manufacturing method of light-emitting device is disclosed. The method includes providing an LED wafer comprising a substrate and a semiconductor stack formed on the substrate, wherein the semiconductor stack has a lower surface facing the substrate and an upper surface opposite to the lower surface; providing a first laser to the LED wafer and irradiating the LED wafer from the upper surface to form a plurality of scribing lines on the upper surface; providing and focusing a second laser on an interior of the substrate to form a plurality of textured areas in the substrate; and providing force on the LED wafer to separate the LED wafer into a plurality of LED chips.


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