The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 20, 2018

Filed:

Jan. 20, 2015
Applicant:

Sharp Kabushiki Kaisha, Sakai, Osaka, JP;

Inventors:

Masatomi Harada, Sakai, JP;

Takeshi Kamikawa, Sakai, JP;

Kazuya Tsujino, Sakai, JP;

Naoki Koide, Sakai, JP;

Naoki Asano, Sakai, JP;

Yuta Matsumoto, Sakai, JP;

Assignee:

SHARP KABUSHIKI KAISHA, Sakai, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 31/0236 (2006.01); H01L 31/0216 (2014.01); H01L 31/0747 (2012.01); H01L 31/0224 (2006.01); H01L 31/0352 (2006.01); H01L 31/05 (2014.01); H01L 31/18 (2006.01); H01L 31/20 (2006.01);
U.S. Cl.
CPC ...
H01L 31/02363 (2013.01); H01L 31/02168 (2013.01); H01L 31/022441 (2013.01); H01L 31/035281 (2013.01); H01L 31/0508 (2013.01); H01L 31/0516 (2013.01); H01L 31/0747 (2013.01); H01L 31/1804 (2013.01); H01L 31/202 (2013.01); Y02E 10/547 (2013.01); Y02P 70/521 (2015.11);
Abstract

There is provided a photoelectric conversion element which includes an n-type single crystal silicon substrate (). The n-type single crystal silicon substrate () includes a central region () and an end-portion region (). The central region () is a region which has the same central point as the central point of the n-type single crystal silicon substrate () and is surrounded by a circle. The diameter of the circle is set to be a length which is 40% of a length of the shortest side among four sides of the n-type single crystal silicon substrate (). The central region () has a thickness t. The end-portion region () is a region of being within 5 mm from an edge of the n-type single crystal silicon substrate (). The end-portion region () is disposed on an outside of the central region () in an in-plane direction of the n-type single crystal silicon substrate (), and has a thickness twhich is thinner than the thickness t. The end-portion region () has average surface roughness which is smaller than average surface roughness of the central region ().


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