The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2018
Filed:
Jan. 21, 2016
Boe Technology Group Co., Ltd., Beijing, CN;
Hefei Xinsheng Optoelectronics Technology Co., Ltd., Hefei, Anhui, CN;
Zhiyuan Lin, Beijing, CN;
Yinhu Huang, Beijing, CN;
Zhixiang Zou, Beijing, CN;
Binbin Cao, Beijing, CN;
BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;
HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD., Hefei, Anhui, CN;
Abstract
A preparation method of a conductive via hole structure, a preparation method of an array substrate and a preparation method of a display device, the preparation method of the array substrate includes: forming a first metal layer () including the first metal structure (), forming a non-metallic film including a first part corresponding to the first metal structure () and an organic insulating film (') in sequence; patterning the organic insulating film (′) to form a first organic insulating layer via hole () corresponding to the first part; then baking to form an organic insulating layer (); and then, removing the first part of the non-metallic film to form a non-metallic layer and expose the part of the surface () of the first metal structure (). This method can avoid the metal structure from being seriously oxidized.