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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10134718 B1

PDFFull Text
Date of Patent:
Nov. 20, 2018

Filed:

Jun. 28, 2016

Power semiconductor module

Applicant:

Mitsubishi Electric Corporation, Chiyoda-ku, JP;

Inventors:

Yasushige Mukunoki, Chiyoda-ku, JP;

Yoshiko Tamada, Chiyoda-ku, JP;

Assignee:

Mitsubishi Electric Corporation, Chiyoda-ku, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Dung Le

Int. Cl.
CPC ...
H01L 25/18 (2006.01); H01L 25/07 (2006.01); H02M 7/48 (2007.01); H01L 23/498 (2006.01); H02M 7/00 (2006.01); H02M 7/5387 (2007.01); H01L 23/538 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 23/49811 (2013.01); H01L 23/49838 (2013.01); H01L 23/5386 (2013.01); H01L 24/48 (2013.01); H01L 25/07 (2013.01); H02M 7/003 (2013.01); H02M 7/48 (2013.01); H02M 7/5387 (2013.01); H01L 23/367 (2013.01); H01L 24/08 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/08054 (2013.01); H01L 2224/08055 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49113 (2013.01); H01L 2924/12031 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1425 (2013.01); H01L 2924/30107 (2013.01);
Abstract

A power semiconductor module including a positive-side switching device and a positive-side diode device which are mounted on a positive-side conductive pattern, and a negative-side switching device and a negative-side diode device which are mounted on an output-side conductive pattern. When an insulating substrate is viewed in plan view, the positive-side diode device and the negative-side diode device are disposed between the positive-side switching device and the negative-side switching device, and the negative-side diode device is disposed closer to the positive-side switching device than the positive-side diode device is.

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