The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 20, 2018

Filed:

Nov. 08, 2013
Applicants:

Richard Speer, Concord, MA (US);

David Hamby, Andover, MA (US);

John Selverian, North Reading, MA (US);

Inventors:

Richard Speer, Concord, MA (US);

David Hamby, Andover, MA (US);

John Selverian, North Reading, MA (US);

Assignee:

OSRAM SYLVANIA Inc., Wilmington, MA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 29/205 (2006.01); H01L 25/075 (2006.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); H05K 3/10 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H05K 1/189 (2013.01); H05K 3/103 (2013.01); H01L 2924/0002 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01); H05K 1/0274 (2013.01); H05K 1/0287 (2013.01); H05K 1/181 (2013.01); H05K 2201/1028 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/2054 (2013.01); H05K 2203/063 (2013.01);
Abstract

Techniques are disclosed for making a flexible laminated circuit board using a metal conductor onto which a SMD may be attached. Conductive metal strips may be laminated to form a flexible substrate and the metal strips may then be perforated for the placement of LED package leads. The LED packages may be attached to the conductive strips using solder or a conductive epoxy and the upper laminate layer may include perforations exposing portions of the metal strips for the attachment of the LED packages. Alternatively, strings of LED packages may be fabricated by attaching LED packages to conductive strips and these strings may be laminated between flexible sheets to form a laminated LED circuit. Plastic housings may aid in attaching the LED packages to the conductive strips. The plastic housings and/or the laminate sheets may be made of a reflective material.


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