The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2018
Filed:
Jul. 03, 2015
Renesas Electronics Corporation, Tokyo, JP;
Tatsuya Kobayashi, Tokyo, JP;
Soshi Kuroda, Tokyo, JP;
Renesas Electronics Corporation, Koutou-ku, Tokyo, JP;
Abstract
A BGAincludes a wiring substrate, a semiconductor chipfixed on the wiring substrate, a sealing bodythat seals the semiconductor chip, and a plurality of solder ballsprovided on a lower surface of the wiring substrate. A degree of flatness of an upper surfaceof a first wiring layerof the wiring substrateof the BGAis lower than a degree of flatness of a lower surface, and a first patternprovided in a second wiring layeris arranged at a position overlapping a first patternprovided in the first wiring layer. Also, an area of the first patternprovided in the first wiring layeris larger than an area of a plurality of (for example, two) second patternsprovided in the second wiring layerin a plan view, and a first opening portionthrough which a part of a second insulating layeris exposed is formed in the first patternprovided in the second wiring layer