The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2018
Filed:
Sep. 08, 2015
Applicant:
Sony Corporation, Tokyo, JP;
Inventors:
Kiwamu Adachi, Kanagawa, JP;
Katsuji Matsumoto, Kanagawa, JP;
Takeshi Kodama, Kanagawa, JP;
Shuichi Oka, Kanagawa, JP;
Hiizu Ootorii, Kanagawa, JP;
Kazunari Saitou, Kanagawa, JP;
Kei Satou, Kanagawa, JP;
Assignee:
Sony Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 23/498 (2006.01); H01L 23/12 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49811 (2013.01); H01L 21/4853 (2013.01); H01L 23/12 (2013.01); H01L 24/11 (2013.01); H01L 24/17 (2013.01); H01L 2224/11825 (2013.01); H01L 2224/18 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73259 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/92244 (2013.01);
Abstract
A method of manufacturing a mounting substrate according to an embodiment of the present technology includes the following three steps: