The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2018
Filed:
Jul. 26, 2017
Infineon Technologies Ag, Neubiberg, DE;
Hans Hartung, Warstein, DE;
Reinhold Bayerer, Reichelsheim, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
One aspect relates to a power semiconductor module. The module includes a module housing, a substrate, and a semiconductor chip attached to the substrate. The semiconductor chip is disposed in the module housing. A dielectric first encapsulation is disposed in the module housing, in physical contact with both the semiconductor chip and the substrate and has a first modulus of elasticity. A dielectric second encapsulation is disposed in the module housing and has a second modulus of elasticity. The first encapsulation is a polymer and disposed between the substrate and the second encapsulation. The semiconductor chip is disposed between the first encapsulation and the substrate. Further, the first modulus of elasticity is greater than the second modulus of elasticity.