The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 20, 2018

Filed:

Sep. 22, 2016
Applicant:

Macau University of Science and Technology, Taipa, MO;

Inventors:

Yan Qiao, Taipa, MO;

Mengchu Zhou, Taipa, MO;

Naiqi Wu, Taipa, MO;

Zhiwu Li, Taipa, MO;

Qinghua Zhu, Taipa, MO;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/677 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67167 (2013.01); H01L 21/677 (2013.01); H01L 21/67745 (2013.01);
Abstract

A system and method for a cluster tool apparatus for processing a semiconductor product including processing modules located adjacent each other and configured to process a semiconductor module, loadlocks configured to retain and dispense unprocessed semiconductor products and each positioned adjacent one of the processing modules, a robot configured to load, transfer and unload a semiconductor product to and from the processing modules, a hardware controller in communication with the robot and executing a method to close down the cluster tool apparatus to an idle state, the method including determining a status of the processing modules, determining if a close down process is required based on the status or based on a close down signal, and, if required, determining a schedule for a close down process based on a semiconductor product residency parameter, and controlling the operation of the robot based on the schedule to perform the close down process.


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