The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2018
Filed:
May. 29, 2014
Applicant:
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Inventor:
Min-Su Chang, Incheon, KR;
Assignee:
Samsung Electonics Co., Ltd, , KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/14 (2006.01); G06F 1/16 (2006.01); B29C 45/14 (2006.01); B65D 25/14 (2006.01); B29L 31/34 (2006.01); B32B 38/10 (2006.01); B32B 37/12 (2006.01); B32B 37/24 (2006.01);
U.S. Cl.
CPC ...
G06F 1/1633 (2013.01); B29C 45/14827 (2013.01); B32B 37/14 (2013.01); B65D 25/14 (2013.01); B29L 2031/3437 (2013.01); B32B 37/12 (2013.01); B32B 38/10 (2013.01); B32B 2037/243 (2013.01); Y10T 156/1002 (2015.01); Y10T 428/24851 (2015.01);
Abstract
A method of manufacturing a case frame is provided. The method includes forming a mold for forming an ultraviolet molding pattern layer, laminating a hard coating layer on a transfer resin film, laminating an ultraviolet molding pattern layer on the hard coating layer, laminating a deposition layer on the ultraviolet molding pattern layer, laminating a printing layer on the deposition layer, and performing transfer IMD on an injection product using a transfer resin film, on which the printing layer, the deposition layer, the ultraviolet molding pattern layer, and the hard coating layer are successively laminated.