The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 20, 2018

Filed:

Apr. 25, 2017
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Koji Yasuda, Osaka, JP;

Kenji Kusunoki, Osaka, JP;

Fumitaka Kikuchi, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03B 17/55 (2006.01); H05K 7/20 (2006.01); H05K 5/04 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); H04N 5/225 (2006.01); H04N 5/232 (2006.01); G06F 1/20 (2006.01); G03B 21/16 (2006.01);
U.S. Cl.
CPC ...
G03B 17/55 (2013.01); H04N 5/2252 (2013.01); G03B 21/16 (2013.01); G06F 1/20 (2013.01); H04N 5/23293 (2013.01); H05K 7/2039 (2013.01); H05K 7/2049 (2013.01);
Abstract

An electronic device includes: an electronic part; an external case that covers the electronic part and constitutes an exterior; and a heat dissipation frame that transmits heat generated from the electronic part to the external case. The external case includes a top case, a front case, and a rear case, while the heat dissipation frame includes a first heat dissipation frame, a second heat dissipation frame, and a third heat dissipation frame provided independently from each other. Mechanical fixation is made to combine the top case and the first heat dissipation frame into one body, to combine the front case and the second heat dissipation frame into one body, and to combine the rear case and the third heat dissipation frame into one body.


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