The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 20, 2018

Filed:

May. 31, 2016
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Dashen Chu, Hartland, WI (US);

Scott Allen Lindsay, Dousman, WI (US);

Dawei Gui, Sussex, WI (US);

James Hiroshi Akao, Brookfield, WI (US);

Zhu Li, Pewaukee, WI (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01V 3/00 (2006.01); G01R 33/341 (2006.01); G01R 33/34 (2006.01); G01R 33/30 (2006.01); G01R 33/36 (2006.01); H01F 7/20 (2006.01); H03H 7/40 (2006.01);
U.S. Cl.
CPC ...
G01R 33/34084 (2013.01); G01R 33/30 (2013.01); G01R 33/3614 (2013.01); H01F 7/202 (2013.01); H03H 7/40 (2013.01);
Abstract

In one example, an RF coil array includes a first RF coil configured to generate a magnetic field along a first axis, the first RF coil having a first surface, a second RF coil configured to generate a magnetic field along a second axis, orthogonal to the first axis, the second RF coil having a second surface, and a first foldable interconnect coupling the first RF coil to the second RF coil. The first foldable interconnect may be adjusted to couple the first RF coil to the second RF coil with a first amount of overlap and with the first surface and second surface facing a common direction, or couple the first RF coil to the second RF coil with a second amount of overlap, larger than the first amount of overlap, and with the first surface in face to face position with the second surface.


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