logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10132575 B1

PDFFull Text
Date of Patent:
Nov. 20, 2018

Filed:

Mar. 28, 2017

Heat conduction member, production method for heat conduction member, and heat conduction structure

Applicant:

Kitagawa Industries Co., Ltd., Aichi, JP;

Inventors:

Takashi Mizuno, Aichi, JP;

Hideo Yumi, Aichi, JP;

Assignee:

KITAGAWA INDUSTRIES CO., LTD., Aichi, JP;

Attorney:

Renner, Otto, Boisselle & Sklar, LLP

Primary Examiner:

Justin Jonaitis

Int. Cl.
CPC ...
F28F 13/18 (2006.01); F28F 21/06 (2006.01); F28F 21/08 (2006.01); H01L 23/31 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
F28F 13/18 (2013.01); F28F 21/06 (2013.01); F28F 21/089 (2013.01); H01L 23/3121 (2013.01); F28F 2275/12 (2013.01); H01L 23/3735 (2013.01); H01L 23/3736 (2013.01); H01L 23/3737 (2013.01);
Abstract

The heat conduction member comprises a laminate formed by laminating a resin layer and a metal layer. The resin layer is formed from a thermally conductive resin material. The thickness of the laminate is smaller at the peripheral edge of the laminate than in the center portion of the laminate, and the thickness of the laminate is greater in the intermediate portion of the laminate than in the center portion of the laminate. An inclined surface is formed on the laminate so as to form a falling gradient from the intermediate portion toward the peripheral edge.

Find Patent Forward Citations

Mizuno, Takashi. (2018). Heat conduction member, production method for heat conduction member, and heat conduction structure (U.S. Patent No. 10132575). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10132575

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…