The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 20, 2018

Filed:

Jan. 29, 2016
Applicants:

Rolls-royce Corporation, Indianapolis, IN (US);

Rolls-royce North American Technologies, Inc., Indianapolis, IN (US);

Inventors:

Igor Vaisman, Carmel, IN (US);

Steve T. Gagne, Avon, IN (US);

Kyle Burkholder, Indianapolis, IN (US);

Assignees:

Rolls-Royce Corporation, Indianapolis, IN (US);

Rolls-Royce North American Technologies, Inc., Indianapolis, IN (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F25B 1/00 (2006.01); F25B 9/00 (2006.01); F25B 1/10 (2006.01); F25B 11/02 (2006.01); F25B 25/00 (2006.01); F25B 41/00 (2006.01); F25B 49/02 (2006.01); F25B 5/02 (2006.01); F25B 40/00 (2006.01); F25B 41/04 (2006.01);
U.S. Cl.
CPC ...
F25B 9/008 (2013.01); F25B 1/10 (2013.01); F25B 11/02 (2013.01); F25B 25/005 (2013.01); F25B 41/00 (2013.01); F25B 49/02 (2013.01); F25B 5/02 (2013.01); F25B 40/00 (2013.01); F25B 41/04 (2013.01); F25B 2309/061 (2013.01); F25B 2341/0011 (2013.01); F25B 2400/0401 (2013.01); F25B 2400/0409 (2013.01); F25B 2400/0411 (2013.01); F25B 2400/061 (2013.01); F25B 2400/072 (2013.01); F25B 2400/13 (2013.01); F25B 2400/14 (2013.01); F25B 2400/24 (2013.01);
Abstract

A thermal management system includes a closed dynamic cooling circuit, and a closed first steady-state cooling circuit. Each circuit has its own compressor, heat rejection exchanger, and expansion device. A thermal energy storage (TES) system is configured to receive a dynamic load and thermally couple the dynamic cooling circuit and the first steady-state cooling circuit. The dynamic cooling circuit is configured to cool the TES to fully absorb thermal energy received by the TES when a dynamic thermal load is ON, and the steady-state cooling circuit is configured to cool the TES when the dynamic thermal load is OFF.


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