The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 20, 2018

Filed:

Jun. 20, 2016
Applicant:

Apple Inc., Cupertino, CA (US);

Inventor:

Michael Rosenblatt, Cupertino, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65D 25/02 (2006.01); H02J 50/20 (2016.01); B65D 75/52 (2006.01); G06F 1/16 (2006.01); G08C 19/00 (2006.01); H02J 17/00 (2006.01); H03K 17/94 (2006.01); H04B 7/26 (2006.01); H02J 50/80 (2016.01); B65D 75/56 (2006.01);
U.S. Cl.
CPC ...
B65D 25/02 (2013.01); B65D 75/52 (2013.01); B65D 75/566 (2013.01); G06F 1/1632 (2013.01); G08C 19/00 (2013.01); H02J 17/00 (2013.01); H02J 50/20 (2016.02); H02J 50/80 (2016.02); H03K 17/94 (2013.01); H04B 7/26 (2013.01); B65D 2201/00 (2013.01); Y10T 307/766 (2015.04);
Abstract

Active packaging for supplying power, data, or both power and data to an electronic media device while the device is housed within the active packaging is provided. The active packaging may include one or more electrical traces in-molded or printed onto the packaging that couple to a suitable connector on the device. Power may also be provided via one or more wireless power techniques. Multiple active packages may be conductively stacked to transmit power, data, or both power and data to a row or stack or devices. POM sensors integrated with or attached to the device (or the active packaging itself) may detect various movement events. Coordinated and synchronized display effects may be presented while the devices are housed within the active packaging.


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