The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 20, 2018

Filed:

Mar. 27, 2013
Applicant:

Alfa Laval Corporate Ab, Lund, SE;

Inventors:

Per Sjödin, Lund, SE;

Kristian Walter, Genarp, SE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/20 (2006.01); B23K 35/22 (2006.01); C22C 19/00 (2006.01); B23K 35/365 (2006.01); B23K 35/00 (2006.01); B23K 35/02 (2006.01); C22C 1/02 (2006.01); B23K 1/00 (2006.01); B23K 35/24 (2006.01); B23K 35/34 (2006.01); B23K 35/362 (2006.01); C23C 30/00 (2006.01); B21D 53/04 (2006.01); F28D 9/00 (2006.01); B32B 15/01 (2006.01); C23C 24/10 (2006.01); B23K 20/00 (2006.01); B23K 20/24 (2006.01); B23K 35/36 (2006.01); B23K 101/00 (2006.01); F28F 3/04 (2006.01); F28F 21/08 (2006.01);
U.S. Cl.
CPC ...
B23K 1/20 (2013.01); B21D 53/04 (2013.01); B23K 1/00 (2013.01); B23K 1/0008 (2013.01); B23K 1/0012 (2013.01); B23K 1/203 (2013.01); B23K 20/002 (2013.01); B23K 20/24 (2013.01); B23K 35/00 (2013.01); B23K 35/001 (2013.01); B23K 35/004 (2013.01); B23K 35/007 (2013.01); B23K 35/02 (2013.01); B23K 35/025 (2013.01); B23K 35/0244 (2013.01); B23K 35/24 (2013.01); B23K 35/34 (2013.01); B23K 35/36 (2013.01); B23K 35/362 (2013.01); B23K 35/365 (2013.01); B23K 35/3613 (2013.01); B32B 15/01 (2013.01); C22C 1/02 (2013.01); C22C 19/00 (2013.01); C23C 24/10 (2013.01); C23C 30/00 (2013.01); C23C 30/005 (2013.01); F28D 9/0062 (2013.01); B23K 2101/00 (2018.08); F28D 9/0012 (2013.01); F28F 3/042 (2013.01); F28F 21/083 (2013.01); F28F 21/089 (2013.01); Y10T 29/49366 (2015.01); Y10T 403/479 (2015.01); Y10T 428/12778 (2015.01); Y10T 428/12986 (2015.01); Y10T 428/25 (2015.01); Y10T 428/259 (2015.01); Y10T 428/266 (2015.01); Y10T 428/273 (2015.01); Y10T 428/2924 (2015.01); Y10T 428/2982 (2015.01);
Abstract

A method for joining a first metal part () with a second metal part (), the metal parts () having a solidus temperature above 1100 QC. The method comprises: applying a melting depressant composition () on a surface () of the first metal part (), the melting depressant composition () comprising a melting depressant component that comprises at least 25 wt % boron and silicon for decreasing a melting temperature of the first metal part (); bringing () the second metal part () into contact with the melting depressant composition () at a contact point () on said surface (); heating the first and second metal parts () to a temperature above 1100 QC; and allowing a melted metal layer () of the first metal component () to solidify, such that a joint () is obtained at the contact point (). The melting depressant composition and related products are also described.


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