The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 20, 2018

Filed:

Jul. 28, 2017
Applicant:

The Procter & Gamble Company, Cincinnati, OH (US);

Inventors:

Kurt Franklin Trombley, Loveland, OH (US);

Karen Lai-Ting Chan, Villa Hills, KY (US);

Isabelle Lafosse-Marin, West Chester, OH (US);

Jay Robert Morosey, Jr., Maineville, OH (US);

Karla Mishell Sanchez, Cincinnati, OH (US);

Kelly Lee Schmeichel, Cincinnati, OH (US);

Assignee:

The Procter & Gamble Company, Cincinnati, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65D 83/04 (2006.01); B65D 75/36 (2006.01); A61J 1/03 (2006.01);
U.S. Cl.
CPC ...
A61J 1/035 (2013.01); B65D 75/36 (2013.01); B65D 75/367 (2013.01); B65D 2215/00 (2013.01); B65D 2575/367 (2013.01);
Abstract

A child-resistant blister package. The package has a top face, a bottom face, and a periphery. The package also has a protection layer with a top face, a bottom face and a periphery; a blister layer with one or more cavities; and an access layer with a top face, a bottom face, and a periphery. The bottom face of the access layer has a line of weakness that allows the unit dose to be removed from the cavity in one-step by applying a force to the top of the cavity and pressing the unit dose through the line of weakness. The bottom face of the protection layer and the top face of the access layer are permanently joined along substantially the entire periphery of the package. The blister package can also contain a tear resistant layer.


Find Patent Forward Citations

Loading…