The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 20, 2018

Filed:

Aug. 21, 2012
Applicants:

Yasuo Miyajima, Utsunomiya, JP;

Hironobu Hongou, Otawara, JP;

Toru Hirano, Otawara, JP;

Isao Uchiumi, Nasushiobara, JP;

Nobuyuki Iwama, Nasushiobara, JP;

Masaaki Ishitsuka, Nasushiobara, JP;

Inventors:

Yasuo Miyajima, Utsunomiya, JP;

Hironobu Hongou, Otawara, JP;

Toru Hirano, Otawara, JP;

Isao Uchiumi, Nasushiobara, JP;

Nobuyuki Iwama, Nasushiobara, JP;

Masaaki Ishitsuka, Nasushiobara, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 8/14 (2006.01); A61B 8/00 (2006.01); A61B 8/06 (2006.01);
U.S. Cl.
CPC ...
A61B 8/4444 (2013.01); A61B 8/06 (2013.01); A61B 8/546 (2013.01); A61B 2562/16 (2013.01);
Abstract

An ultrasound probe and ultrasonic diagnosis apparatus that can maintain surface temperature of an ultrasound probe within a safe range, without reduction in performance. The ultrasound probe includes a casing, a transducer, an electronic circuit, and a heat-transfer construction. Elements of the transducer are aligned at one end of the casing and send out ultrasound waves in accordance with their respective delay times. The electronic circuit, disposed in the casing, includes a delay circuit setting delay times and pulsers for generating pulses in accordance with the delay times, the pulses being sent to the transducer. While the electronic circuit is being energized, the heat-transfer construction disposes a member having a low heat conductivity at least either between the electronic circuit and the casing or between the electronic circuit and the transducer. Thereby, heat from the electronic circuit is conducted to the other end of the casing.


Find Patent Forward Citations

Loading…