The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2018
Filed:
Jun. 13, 2016
Todd Miller, San Jose, CA (US);
Todd Miller, San Jose, CA (US);
Other;
Abstract
An intraoral x-ray imaging sensor includes an electronic interface substrate which has a first surface and a second surface and is substantially rectangular with a mesial end and a distal end and a semiconductor imager which is mechanically and electrically coupled to the electronic interface substrate and which has a first surface and a second surface. The semiconductor imager consists of a silicon layer having an array of detector elements formed on its the first surface and is substantially rectangular with a mesial end and a distal end. The electronic interface substrate and the semiconductor imager have a first cut corner and a second cut corner at its the distal end. The second surface of the semiconductor imager is disposed adjacent and contiguous to the first surface of the electronic interface substrate. The intraoral x-ray imaging sensor also includes a plurality of first electrical pads, a plurality of second electrical pads and a plurality of bond wires. The first electrical pads are disposed on the first surface of the electronic interface substrate wherein some of the first electrical pads are disposed adjacent and contiguous to the first cut corner and the remainder of the first electrical pads are disposed adjacent and contiguous to the second cut corner. The second electrical pads are disposed on the first surface of the semiconductor imager wherein some of the of second electrical pads are disposed adjacent and contiguous to the first cut corner and the remainder of the second electrical pads are disposed adjacent and contiguous to the second cut corner. Each bond wire electrically couples one of the first electrical pads to one of the second electrical pads.