The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2018
Filed:
Jun. 29, 2016
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
John U. Knickerbocker, Monroe, NY (US);
Shriya Kumar, New York, NY (US);
Jae-Woong Nah, Closter, NJ (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); A61B 5/00 (2006.01); H01L 23/15 (2006.01); H01L 23/498 (2006.01); H01L 23/532 (2006.01); H01L 21/48 (2006.01); H05K 1/03 (2006.01); H01L 23/00 (2006.01); A61M 5/00 (2006.01); B23K 3/06 (2006.01); H01L 23/538 (2006.01); H01L 23/66 (2006.01); H05K 3/40 (2006.01); B23K 101/36 (2006.01);
U.S. Cl.
CPC ...
A61B 5/68 (2013.01); A61M 5/00 (2013.01); B23K 3/0638 (2013.01); H01L 21/486 (2013.01); H01L 21/76816 (2013.01); H01L 21/76852 (2013.01); H01L 21/76883 (2013.01); H01L 21/76898 (2013.01); H01L 23/15 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/5389 (2013.01); H01L 23/53228 (2013.01); H01L 23/53238 (2013.01); H01L 23/53242 (2013.01); H01L 23/53252 (2013.01); H01L 23/53266 (2013.01); H01L 23/66 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); H01L 24/64 (2013.01); H01L 24/69 (2013.01); H01L 24/83 (2013.01); H01L 24/89 (2013.01); H05K 1/0306 (2013.01); H05K 3/4038 (2013.01); A61B 2562/12 (2013.01); A61M 2207/00 (2013.01); B23K 2201/36 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/27312 (2013.01); H01L 2224/325 (2013.01); H01L 2224/32111 (2013.01); H01L 2224/32235 (2013.01); H01L 2224/64 (2013.01); H01L 2224/69 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/89 (2013.01); H01L 2224/96 (2013.01); H01L 2924/014 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/15332 (2013.01); H05K 2201/0305 (2013.01);
Abstract
A method includes forming one or more vias in a substrate, forming at least one liner on at least one sidewall of at least one of the vias, and filling said at least one via with solder material using injection molded soldering. The at least one liner may comprise a solder adhesion layer, a barrier layer, or a combination of a barrier layer and a solder adhesion layer.