The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 13, 2018

Filed:

May. 22, 2017
Applicant:

Honeywell International Inc., Morris Plains, NJ (US);

Inventors:

Peter Charles Strickland, Ottawa, CA;

Sergiy Borysenko, Ottawa, CA;

Bradley Jessup, Ottawa, CA;

Assignee:

Honeywell International Inc., Morris Plains, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 5/00 (2006.01); H05K 7/20 (2006.01); H05K 1/02 (2006.01); H05K 3/06 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20 (2013.01); H05K 1/0204 (2013.01); H05K 1/0209 (2013.01); H05K 3/06 (2013.01); H05K 999/99 (2013.01); H05K 2201/062 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10219 (2013.01); Y10T 29/49156 (2015.01); Y10T 29/49361 (2015.01);
Abstract

A printed circuit board for use with a cooling device configured to cool at least one device is provided. The printed circuit board includes a substrate having a first surface and a second surface opposing the first surface; a ground plane on the first surface of the substrate, and circuitry in a circuit-region on the second surface of the substrate. The ground plane includes a patterned-region that is patterned with an array of holes. The circuitry is configured for use with the at least one device to be cooled. When a first side of the cooling device contacts the ground plane, and when the at least one device to be cooled contacts the circuitry, a reduced cross-sectional area of the patterned-region prevents heat from a second side of the cooling device from degrading performance of the at least one device.


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