The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 13, 2018

Filed:

Dec. 21, 2015
Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventors:

Harun Bueyuekgoez, Pfullingen, DE;

Roland Gerstner, Reutlingen, DE;

Josef Weber, Reutlingen, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 3/10 (2006.01); H05K 3/46 (2006.01); H05K 3/40 (2006.01); H05K 1/11 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4629 (2013.01); H05K 1/0206 (2013.01); H05K 1/115 (2013.01); H05K 3/4046 (2013.01); H05K 1/0204 (2013.01); H05K 2201/0376 (2013.01); H05K 2201/10416 (2013.01);
Abstract

The invention relates to a circuit carrier () comprising a plurality of inorganic substrate layers () that have partial metallizations () for the purpose of electrical and/or thermal conduction, and to a corresponding method for producing such a circuit carrier (). According to the invention, at least one partial metallization is made in the form of an insert () that fills a corresponding shaped hole () introduced into one of said inorganic substrate layers ().


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