The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2018
Filed:
Oct. 01, 2015
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventor:
Noriaki Matsunaga, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/05 (2006.01); H02K 11/30 (2016.01); H05K 3/30 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H01L 23/3121 (2013.01); H01L 23/3135 (2013.01); H02K 11/30 (2016.01); H05K 1/053 (2013.01); H05K 3/303 (2013.01); H01L 2924/0002 (2013.01); H05K 2201/1009 (2013.01);
Abstract
An electronic component mounting substrate includes an electronic component mounted on a surface of a substrate, an electrode portion disposed on the surface of the substrate and electrically connected to the electronic component, a lead wire connected to the electrode portion, and an encapsulation resin configured to encapsulate a part of the lead wire, the electronic component, and the electrode portion. A surface of at least the part of the lead wire encapsulated by the encapsulation resin and the surface of the substrate are coated with a deposited film.