The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 13, 2018

Filed:

Sep. 15, 2015
Applicants:

Fujikura Ltd., Tokyo, JP;

Ddk Ltd., Tokyo, JP;

Inventors:

Yuki Ishida, Tokyo, JP;

Masayuki Suzuki, Tokyo, JP;

Harunori Urai, Tokyo, JP;

Isao Kojima, Tokyo, JP;

Assignees:

FUJIKURA LTD., Tokyo, JP;

DDK LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 3/22 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); H05K 1/0218 (2013.01); H05K 1/0245 (2013.01); H05K 1/118 (2013.01); H05K 3/22 (2013.01); H05K 3/4644 (2013.01); H05K 1/0216 (2013.01); H05K 1/0221 (2013.01); H05K 1/0298 (2013.01); H05K 1/117 (2013.01); H05K 2201/09236 (2013.01); H05K 2201/09363 (2013.01);
Abstract

A printed wiring board includes one or more substrates, the one or more substrates including at least a first substrate, the first substrate being formed with a pad and a ground layer at any one of main surfaces of the first substrate, the pad being to be electrically connected to a connector as another component, the ground layer being formed to surround the pad from a circumference of the pad and have an inner edge at a location separated from an outer edge of the pad with a predetermined distance, the ground layer being to be grounded to a ground contact.


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