The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2018
Filed:
May. 21, 2015
Nichia Corporation, Anan-shi, JP;
Takuya Nakabayashi, Tokushima, JP;
Akira Hori, Tokushima, JP;
NICHIA CORPORATION, Anan-shi, JP;
Abstract
A semiconductor device mounting structure includes a semiconductor device and a mounting substrate. The semiconductor device includes a first external connection terminal and a device-side mounting insulating region. The first external connection terminal is provided at a first end and has a metal region on a semiconductor mounting surface of the semiconductor device. The device-side mounting insulating region is defined by the metal region on the semiconductor mounting surface. The semiconductor mounting surface faces a substrate mounting surface. The mounting substrate has on the substrate mounting surface a land pattern made of an electrically conductive material to be electrically connected to the first external connection terminal. The land pattern is provided in a first shape to surround the device-side mounting insulating region and includes a land-side insulating region which has a second shape to correspond to a periphery of the device-side mounting insulating region.