The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2018
Filed:
Apr. 21, 2015
Applicant:
Northrop Grumman Systems Corporation, Falls Church, VA (US);
Inventors:
Daniel J. Braley, Brea, CA (US);
Eric G. Barnes, Rancho Palos Verdes, CA (US);
Pedro Gonzalez, El Segundo, CA (US);
Assignee:
Northrop Grumman Systems Corporation, Falls Church, VA (US);
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/00 (2017.01); H05K 1/09 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01); B33Y 80/00 (2015.01); H05K 3/10 (2006.01); B33Y 70/00 (2015.01); B29C 64/106 (2017.01); H05K 3/12 (2006.01); B29K 23/00 (2006.01); B29K 305/00 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/09 (2013.01); B29C 64/106 (2017.08); B33Y 70/00 (2014.12); B33Y 80/00 (2014.12); H05K 1/032 (2013.01); H05K 3/10 (2013.01); H05K 3/4664 (2013.01); B29K 2023/0666 (2013.01); B29K 2305/00 (2013.01); B29L 2031/3425 (2013.01); H05K 1/0393 (2013.01); H05K 3/1241 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/0158 (2013.01); H05K 2203/0126 (2013.01);
Abstract
An electronic component, such as a circuit board, fabricated by coextruding an Ultra High Molecular Weight Polyethylene (UHMWPE) filament, such as a Dyneema® filament, and a conductive material, such as an Indalloy wire, using only a three-dimensional printer, such as an FDM machine.