The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2018
Filed:
Mar. 20, 2017
Applicants:
Joinset Co., Ltd., Ansan-si, Gyeonggi-do, KR;
Sun-ki Kim, Gunpo-si, Gyeonggi-do, KR;
Inventor:
Sun-Ki Kim, Gunpo-si, KR;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 4/58 (2006.01); H01R 4/62 (2006.01); H01R 12/57 (2011.01); H01R 43/00 (2006.01); H05K 1/11 (2006.01); H05K 3/34 (2006.01); H01R 11/01 (2006.01); H01R 13/6584 (2011.01); H01R 13/24 (2006.01);
U.S. Cl.
CPC ...
H01R 4/625 (2013.01); H01R 4/58 (2013.01); H01R 11/01 (2013.01); H01R 12/57 (2013.01); H01R 13/24 (2013.01); H01R 13/6584 (2013.01); H01R 43/007 (2013.01); H05K 1/11 (2013.01); H05K 3/34 (2013.01); H01R 13/2414 (2013.01); H05K 3/3431 (2013.01); H05K 2201/1031 (2013.01); Y02P 70/611 (2015.11);
Abstract
Disclosed is an elastic electric contact terminal comprising: an elastic core; a polymer film which is bonded while covering the core, with an adhesive layer being interposed therebetween; and a copper foil capable of being soldered, which is bonded while covering the polymer film. A metal plating layer is formed on every surface exposed outwardly from the copper foil.