The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10128414 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 13, 2018

Filed:

Dec. 30, 2015
Applicant:

Point Engineering Co., Ltd., Asan-si, KR;

Inventors:

Seung Ho Park, Hwaseong-si, KR;

Tae Hwan Song, Cheonan-si, KR;

Assignee:

Point Engineering Co., Ltd., Asan-si, Chungcheongnam-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/58 (2010.01); H01L 33/48 (2010.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
H01L 33/486 (2013.01); H01L 33/58 (2013.01); H01L 33/644 (2013.01); H01L 2224/48137 (2013.01);
Abstract

A chip substrate includes: a plurality of conductive layers horizontally stacked and constituting the chip substrate; a plurality of insulation layers alternately with the conductive layers and electrically separating the conductive layers; a lens insert comprising a groove having a predetermined number of edges on the upper surface of the chip substrate and having a cross-section wherein an arc is formed at the region where the extended edges meet; a cavity comprising a groove reaching down to a predetermined depth towards the area accommodating the insulation layer within the internal region of the lens insert; and a plurality of joining grooves formed on the surface of the lens insert. Thus, the lens to be inserted also can be formed to be a shape comprising straight lines so that the manufacturing process of the lens to be inserted into the chip substrate can be further simplified.


Find Patent Forward Citations

Park, Seung. (2018). Chip substrate provided with joining grooves in lens insert (U.S. Patent No. 10128414). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10128414

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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