The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 13, 2018

Filed:

Jul. 27, 2017
Applicant:

Abb Schweiz Ag, Baden, CH;

Inventors:

Luca De-Michielis, Aarau, CH;

Chiara Corvasce, Bergdietikon, CH;

Assignee:

ABB Schweiz AG, Baden, CH;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/739 (2006.01); H01L 29/06 (2006.01); H01L 29/08 (2006.01); H01L 21/225 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7397 (2013.01); H01L 21/2253 (2013.01); H01L 29/0623 (2013.01); H01L 29/0834 (2013.01); H01L 29/66348 (2013.01);
Abstract

An insulated gate power semiconductor device has an (n−) doped drift layer between an emitter side and a collector side. A trench gate electrode has a trench bottom and trench lateral sides and extends to a trench depth. A p doped first protection pillow covers the trench bottom. An n doped second protection pillow encircles the trench gate electrode at its trench lateral sides. The second protection pillow has a maximum doping concentration in a first depth, which is at least half the trench depth, wherein a doping concentration of the second protection pillow decreases towards the emitter side from the maximum doping concentration to a value of not more than half the maximum doping concentration. An n doped enhancement layer has a maximum doping concentration in a second depth, which is lower than the first depth, wherein the doping concentration has a local doping concentration minimum between the second depth and the first depth.


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