The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 13, 2018

Filed:

Oct. 03, 2017
Applicant:

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventor:

Masaki Migita, Fujisawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/00 (2006.01); H01L 27/146 (2006.01); H01L 31/0352 (2006.01); H01L 31/0304 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14634 (2013.01); H01L 27/14605 (2013.01); H01L 27/14607 (2013.01); H01L 27/14618 (2013.01); H01L 27/14636 (2013.01); H01L 27/14643 (2013.01); H01L 31/035236 (2013.01); H01L 31/03046 (2013.01);
Abstract

A light-receiving apparatus includes: a light-receiving device array including a semiconductor structure including a plurality of semiconductor mesas, a plurality of grooves each of which defines one of the semiconductor mesas, a plurality of first electrodes disposed on upper surfaces of the semiconductor mesas, a plurality of first bump electrodes disposed on the first electrodes, and a metal body disposed on a bottom surface of at least one of the grooves, the metal body being spaced apart from the first electrodes and the first bump electrodes; a semiconductor device processing an electric signal from the light-receiving device array; and an underfill disposed between the light-receiving device array and the semiconductor device. The metal body is spaced apart from a surface of the semiconductor device. The semiconductor device is joined to the light-receiving device array through the first bump electrodes.


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