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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10128181 B1

PDFFull Text
Date of Patent:
Nov. 13, 2018

Filed:

May. 11, 2016

Package structure and fabricating method thereof

Applicant:

Delta Electronics (Shanghai) Co., Ltd., Shanghai, CN;

Inventors:

Kai Lu, Shanghai, CN;

Zhenqing Zhao, Shanghai, CN;

Tao Wang, Shanghai, CN;

Assignee:

DELTA ELECTRONICS (SHANGHAI) CO., LTD., Shanghai, CN;

Attorneys:

Kirton McConkie

Evan R. Witt

Primary Examiner:

Michael Lebentritt

Assistant Examiner:

Jordan Klein

Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2006.01); H01L 25/18 (2006.01); H01L 23/433 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49861 (2013.01); H01L 21/4846 (2013.01); H01L 21/56 (2013.01); H01L 23/3121 (2013.01); H01L 23/4334 (2013.01); H01L 23/49517 (2013.01); H01L 23/49531 (2013.01); H01L 23/49541 (2013.01); H01L 23/49562 (2013.01); H01L 23/49568 (2013.01); H01L 23/49575 (2013.01); H01L 23/49582 (2013.01); H01L 23/49811 (2013.01); H01L 24/32 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 25/16 (2013.01); H01L 25/18 (2013.01); H01L 23/3107 (2013.01); H01L 24/48 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48101 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48139 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1426 (2013.01); H01L 2924/17747 (2013.01);
Abstract

A package structure includes a first carrier plate, a second carrier plate, a pin group and an encapsulant member. A power component is disposed on a first top surface of the first carrier plate. The second carrier plate is disposed on the first top surface of the first carrier plate. A driving circuit is disposed on a second top surface of the second carrier plate for driving the power component. An opening runs through the second carrier plate, and the power component is accommodated within the opening. The pin group is assembled on the first carrier plate and/or the second carrier plate. The encapsulant member encapsulates the first carrier plate, the second carrier plate, a part of the first pin group and a part of the second pin group, so that the first pin group and the second pin group are partially exposed outside the encapsulant member.

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