The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2018
Filed:
Oct. 15, 2015
Hitachi Automotive Systems, Ltd., Hitachinaka-shi, Ibaraki, JP;
Hiroyuki Temmei, Tokyo, JP;
Mina Amo, Tokyo, JP;
Nobutake Tsuyuno, Tokyo, JP;
Takeshi Tokuyama, Tokyo, JP;
Toshiaki Ishii, Tokyo, JP;
Toshiya Satoh, Hitachinaka, JP;
Hitachi Automotive Systems, Ltd., Ibaraki, JP;
Abstract
An electronic component has a semiconductor element and a thermally conductive support member. A heat sink is disposed on one surface of the circuit body, and a thermally conductive insulating member is interposed between the heat sink and the support member. Input and output terminals and a ground terminal are also provided. A sealing resin is formed to expose a part of each of the input and output terminals and the ground terminal and one surface of the heat sink, and to cover a periphery of the electronic component structure. A main body conductor layer is formed to be insulated from the input and output terminals and cover an immersion region of the sealing resin and one surface of the heat sink immersed in a cooling medium. A ground conductor layer covers at least a part of the ground terminal and is electrically connected with the main body conductor layer.