The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2018
Filed:
May. 19, 2016
Applicant:
Imec Vzw, Leuven, BE;
Inventors:
Bivragh Majeed, Leuven, BE;
Philippe Soussan, Wavre, BE;
Assignee:
IMEC VZW, Leuven, BE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 21/311 (2006.01); H01L 23/532 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/31122 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 23/291 (2013.01); H01L 23/3171 (2013.01); H01L 23/53238 (2013.01); H01L 24/03 (2013.01); H01L 2224/034 (2013.01); H01L 2224/03009 (2013.01); H01L 2224/0361 (2013.01); H01L 2224/03912 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/10145 (2013.01); H01L 2224/11009 (2013.01); H01L 2224/119 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/11602 (2013.01); H01L 2224/13005 (2013.01); H01L 2224/13007 (2013.01); H01L 2224/13014 (2013.01); H01L 2224/13083 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13157 (2013.01); H01L 2224/13164 (2013.01); H01L 2224/14131 (2013.01);
Abstract
Micro bump interconnection structures for semiconductor devices, and more specifically, a substrate structure comprising an array of micrometer scale copper pillar based structures or micro bumps eventually comprising a solder material and a method for manufacturing the same are provided.