The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 13, 2018

Filed:

Aug. 28, 2015
Applicant:

Delta Electronics, Inc., Taoyuan, TW;

Inventors:

Chao-Wen Lu, Taoyuan, TW;

Chun-Chih Wang, Taoyuan, TW;

Ding-Wei Chiu, Taoyuan, TW;

Chung-Hung Tang, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01F 27/08 (2006.01); H01L 23/427 (2006.01);
U.S. Cl.
CPC ...
H01F 27/085 (2013.01); H01L 23/427 (2013.01); H05K 7/20 (2013.01); H05K 7/20172 (2013.01);
Abstract

A heat dissipation device is applied to an electronic device and comprises a heat conduction plate, at least an induction coil and a first heat dissipation plate. The heat conduction plate receives the heat provided by a heat source and includes a first contact element disposed on a first surface of the heat conduction plate. The induction coil is disposed at the heat conduction plate. The first heat dissipation plate is disposed at the first contact element of the heat conduction plate. The first heat dissipation plate and the heat conduction plate form a gap. The first heat dissipation plate includes at least a first magnetic element disposed opposite the induction coil.


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