The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2018
Filed:
Aug. 03, 2015
Sumitomo Electric Industries, Ltd., Osaka-shi, JP;
Autonetworks Technologies, Ltd., Yokkaichi, JP;
Sumitomo Wiring Systems, Ltd., Yokkaichi, JP;
Akiko Inoue, Osaka, JP;
Tetsuya Kuwabara, Osaka, JP;
Taichiro Nishikawa, Osaka, JP;
Kiyotaka Utsunomiya, Osaka, JP;
Hiroshi Fujita, Osaka, JP;
Yasuyuki Ootsuka, Yokkaichi, JP;
Hiroyuki Kobayashi, Yokkaichi, JP;
Sumitomo Electric Industries, Ltd., Osaka-shi, JP;
AutoNetworks Technologies, Ltd., Yokkaichi, JP;
Sumitomo Wiring Systems, Ltd., Yokkaichi, JP;
Abstract
A copper alloy wire can be used as a conductor. The copper alloy wire is made of a copper alloy containing: not less than 0.4 mass % and not more than 1.5 mass % of Fe; not less than 0.1 mass % and not more than 0.7 mass % of Ti; not less than 0.02 mass % and not more than 0.15 mass % of Mg; not less than 10 mass ppm and not more than 500 mass ppm in total of C and at least one of Si and Mn; and the balance of Cu and impurities. The copper alloy wire has a wire diameter of not more than 0.5 mm. Preferably, a mass ratio Fe/Ti in the copper alloy is not less than 1.0 and not more than 5.5.