The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 13, 2018

Filed:

Aug. 02, 2017
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Jae Won Lee, Seoul, KR;

Jae Su Jung, Suwon-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05F 1/20 (2006.01); H03L 7/00 (2006.01); G05F 3/02 (2006.01); G06F 9/4401 (2018.01);
U.S. Cl.
CPC ...
G05F 3/02 (2013.01); G06F 9/4411 (2013.01);
Abstract

A semiconductor chip includes a hardware performance monitor (HPM) unit and an HPM controller. The HPM unit is driven during an initial operation period, a first operation period, and a second operation period, outputs initial HPM data, first HPM data, and second HPM data in the initial operation period, the first operation period, and the second operation period, respectively. The HPM controller performs a first compensation operation of compensating a driving voltage of the semiconductor chip using the initial HPM data and the first HPM data, and a second compensation operation of compensating the driving voltage using the initial HPM data and the second HPM data. The HPM unit provides the initial HPM data, the first HPM data, and the second HPM data, which are correlated with performance of the semiconductor chip, to the HPM controller in a first mode, and does not provide this data in a second mode.


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