The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 13, 2018

Filed:

Apr. 23, 2014
Applicant:

Dai Nippon Printing Co., Ltd., Tokyo-to, JP;

Inventors:

Yoshihiko Ogino, Tokyo-to, JP;

Chikao Ikenaga, Tokyo-to, JP;

Takahiro Sahara, Tokyo-to, JP;

Masahiro Nagata, Tokyo-to, JP;

Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 7/02 (2006.01); G02B 7/04 (2006.01); G02B 7/08 (2006.01); F16F 1/02 (2006.01); F16F 1/18 (2006.01); G03B 13/32 (2006.01); G03B 3/10 (2006.01); G03B 5/00 (2006.01);
U.S. Cl.
CPC ...
G02B 7/04 (2013.01); F16F 1/021 (2013.01); F16F 1/18 (2013.01); G02B 7/026 (2013.01); G02B 7/08 (2013.01); G03B 3/10 (2013.01); G03B 5/00 (2013.01); G03B 13/32 (2013.01); F16F 2224/0208 (2013.01); G03B 2205/0046 (2013.01); G03B 2205/0053 (2013.01);
Abstract

There is provided a leaf spring which can prevent a reduction in the spring strength and can also prevent a reduction in the electrical conductivity when the thickness of the leaf spring is decreased. The leaf spring includes an outer frame portion an inner frame portiondisposed inside the outer frame portion, and spring portions provided between the inner frame portion and the outer frame portion The leaf spring is made of a Cu-based alloy, and has an electrical conductivity of not less than 8% IACS and a 0.2% proof stress of not less than 900 MPa.


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