The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 13, 2018

Filed:

Nov. 13, 2014
Applicant:

Kistler Holding Ag, Winterthur, CH;

Inventors:

Denis Kohler, Neftenbach, CH;

Harry Schneider, Henggart, CH;

Werner Degen, Zurich, CH;

Assignee:

KISTLER HOLDING AG, Winterthur, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01L 1/16 (2006.01); H01L 41/047 (2006.01); H01R 4/48 (2006.01); H01R 13/33 (2006.01); G01L 1/04 (2006.01);
U.S. Cl.
CPC ...
G01L 1/16 (2013.01); G01L 1/042 (2013.01); H01L 41/0475 (2013.01); H01R 4/4863 (2013.01); H01R 13/33 (2013.01);
Abstract

The invention relates to a piezoelectric force sensor () comprising a housing () having at least one piezoelectric body () and an electrode () electrically connected to said body (), wherein a connection device () for forwarding measurement signals having a contact pin () is fastened or molded on the housing (). The contact pin () is connected to the electrode () in an electrically conductive manner. According to the invention, a helical compression spring () is electrically conductively connected to the contact pin () as an electrical connection within the piezoelectric force sensor (). For this purpose, the helical compression spring () is removably electrically conductively connected to the electrode () in an operative manner so that the contact pin () has a spatial clearance from the electrode () and measurement signals from the electrode () can be extracted from the housing () of the piezoelectric force sensor () via the helical compression spring () and the connected contact pin () and can be picked up on the connection device ().


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