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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10126127 B1

PDFFull Text
Date of Patent:
Nov. 13, 2018

Filed:

Apr. 29, 2016

Athermalized mounting of inertial measurement unit

Applicant:

Microsoft Technology Licensing, Llc, Redmond, WA (US);

Inventor:

Navid Poulad, Sunnyvale, CA (US);

Assignee:

Microsoft Technology Licensing, LLC, Redmond, WA (US);

Attorney:

Workman Nydegger

Primary Examiner:

Son Le

Assistant Examiner:

Tarun Sinha

Int. Cl.
CPC ...
G01C 19/00 (2013.01); G01P 15/02 (2013.01); H05K 1/18 (2006.01); H05K 7/14 (2006.01); G01P 1/02 (2006.01); G01P 3/00 (2006.01); H05K 5/00 (2006.01); H05K 1/02 (2006.01); H05K 7/12 (2006.01);
U.S. Cl.
CPC ...
G01C 19/00 (2013.01); G01P 1/023 (2013.01); G01P 3/00 (2013.01); G01P 15/02 (2013.01); H05K 1/181 (2013.01); H05K 5/0078 (2013.01); H05K 7/142 (2013.01); H05K 7/1422 (2013.01); H05K 1/0271 (2013.01); H05K 7/12 (2013.01); H05K 2201/068 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10295 (2013.01); H05K 2201/10393 (2013.01); H05K 2201/2036 (2013.01); H05K 2201/2045 (2013.01);
Abstract

Printed circuit boards (PCBs) are configured with an athermalized mounting suitable for securing and positioning and the PCBs within an inertial measurement unit (IMU). The PCBs include integrated circuit (IC) components, such as accelerometers and/or gyroscopes, which require relative positional stability within the IMU environment in order to provide accurate results. The athermalized mounting configuration of the PCB enables the PCBs to experience thermal expansion within the IMU without causing significant displacement of the IC relative to the IMU environment.

Find Patent Forward Citations

Poulad, Navid. (2018). Athermalized mounting of inertial measurement unit (U.S. Patent No. 10126127). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10126127

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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