The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 13, 2018

Filed:

Jul. 01, 2013
Applicant:

General Electric Company, Schenctady, NY (US);

Inventors:

John David Ward, Jr., Woodruff, SC (US);

Liming Zhang, Greer, SC (US);

Assignee:

GENERAL ELECTRIC COMPANY, Schenectady, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23G 1/02 (2006.01); C23F 1/20 (2006.01); C23F 1/28 (2006.01); C23F 1/44 (2006.01); C23G 1/20 (2006.01); F01D 5/00 (2006.01);
U.S. Cl.
CPC ...
C23G 1/02 (2013.01); C23F 1/20 (2013.01); C23F 1/28 (2013.01); C23F 1/44 (2013.01); C23G 1/20 (2013.01); F01D 5/005 (2013.01);
Abstract

Stripping a metallic bond coat from an article using a wet chemical process. An article removed from service and having a metallic bond coat applied over a surface of its metallic substrate is provided. The metallic bond coat is used to improve the adhesion of a TBC to the article, so grit blasting to first remove any TBC applied over the bond coat and which still remains on the article initially may be required. The bond coated article is then immersed in an acid solution of HCl/HPOat a predetermined temperature for a predetermined amount of time, the HCl/HPOsolution reacting with the bond coat applied over the metallic substrate to form a smut on the surface. The article is then removed from the HCl/HPOsolution and quickly immersed in a solution of NaOH for a predetermined amount of time to at least partially desmut the surface.


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